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Fr4 Copper Thickness Double Sided Blue Solder Mask Electronic Minipad PCB
PCB basic technology:
Material:fr4
Layer:2
Surface finish:ENIG
Copper weight:1OZ
PCB thickness:1.6mm
Solder mask:Green color
Panel:3*2
Name:Minipad PCB printed circuit boards manufacturer in Shenzhen,China
Fr4 double sided pcb manufacturer:
Base material: CEM1 / CEM3 / FR4 / FR4 Lead-free / FR4 Halogen-free
Thickness: 0.2 to 3.2 mm
Design: 200/200µm line & space on 35µm copper. 75/100µm line & space on 12 µm copper (low volume)
Soldermask: UV cured or LDI
Carbon contacts
PCB dimensions: 588 x 510mm / 700 x 500 mm (low volume)
Contouring: Routing / Stamping
Metallic Finishes: HASL (lead-free) / HASL (tin-lead) / Immersion Silver / Immersion Tin / OSP / ENIG / Electrolytic NiAu
Product Range
2-20 layers high density impedance, blind/buried, HDI, high frequency, Halogen free, high TG, Alum,
Cu, and ceramic base PCB
ONESEINE PCB Technology
Layer number: 1-20 layers
Finished board thickness: 0.008’’~0.24’’ (0.2mm~6.0mm)
Min. drilling diameter: 6mil (0.15mm)
Min. trace width/space: 3-4 mil (0.076-0.10mm)
Max. board size: single, double sided 22’’x43’’ (550x1100mm) multilayer 22’’x25’’ (550x640mm)
Impedance control: ±10%
Surface finish: OSP, HAL, HAL lead free, electronic gold, ENIG, gold finger, immersion silver, immersion tin, thick gold plating
Base material: FR4 (Shengyi, KB, Intl.); High TG (TG150, TG170), Halogen free, Alum. Cu, Iron, ceramic base
Fr4 double sided pcb:
Double sided FR4 PCB with HASL
| PCB Technical Capacity | ||
| Item | Production Capacity | |
| 1 | Product | Double sided FR4 PCB with HASL |
| 2 | Layer Counts | 1L-28L |
| 3 | Material | (1) CEM1,CEM3,FR-4 High TG FR4, Halogen-free FR4, Polyimide |
| (2) aluminium, Ceramic(96%Alumina), PTFE(F4B,F4BK) | ||
| (3) Rogers(4003.4350.5880) , Taconic(TLX-8.TLX-9), Arlon(35N.85N) | ||
| 4 | Material Mixed Laminate | FR4+Ro4350.FR4+Aluminium.FR4+FPC |
| 5 | Board Size | (1) Maximum Size |
| (2) Minimum Line/Space | ||
| (3) Board Thickness | ||
| (4) OutLayer Copper Thickness | ||
| (5) InnerLayer Copper Thickness | ||
| (6) Mini Solder Mask Bridge | ||
| 6 | Board Tolerance | (1) Board Outline Tolerance |
| (2) Thickness Tolerance | ||
| (3) Hole Position/hole Tolerance | ||
| (4) Trace width Tolerance | ||
| 7 | Drilling | (1) Minimum Drilling Hole(Mechanical) |
| (2) Minimum Laser hole | ||
| (3) Mini hole ring(single) | ||
| 8 | Surface Finishing | HASL, Lead free HASL,Immersion gold, Immersion tin, Immersion Silver, Plated gold, OSP,Carbon ink |
| 9 | Acceptable File Format | ALL Gerber Files, CAM-350, PROTEL, PADS2000, CAD, ORCAD, P-CAD, CAM2000 ect |
| 10 | Quality Standards | SGS |
| 11 | Packing | Inner vacuum packing, outer standard carton box |
What Is FR4 PCB Material?
FR-4 is a high-strength, high-resistant, glass-reinforced epoxy laminate material used to fabricate printed circuit boards (PCBs). The National Electrical Manufacturers Association (NEMA) defines it as a standard for glass-reinforced epoxy laminates.
The FR stands for flame retardant, and the number 4 differentiates this type of laminate from other similar materials. This particular laminate has woven glass-reinforced epoxy resin.
FR-4 PCB refers to the board manufactured with adjacent laminate material. This material is incorporated in double-sided, single-sided, and multi-layered boards.
ONESEINE'S STANDARD FR-4 MATERIAL PROPERTIES
High Glass Transition Temperature (Tg) (150Tg or 170Tg)
High Decomposition Temperature (Td) (> 345º C)
Low Coefficient of Thermal Expansion (CTE) ((2.5%-3.8%)
Dielectric Constant (@1 GHz): 4.25-4.55
Dissipation Factor (@ 1 GHz): 0.016
UL rated (94V-0, CTI = 3 minimum)
Compatible with standard and lead-free assembly.
Laminate thickness available from 0.005” to 0.125”
Pre-preg thicknesses available (approximate after lamination):
(1080 glass style) 0.0022”
(2116 glass style) 0.0042”
(7628 glass style) 0.0075”
FR4 PCBs are known for their excellent thermal stability, high mechanical strength, and resistance to moisture and chemicals. These properties make them suitable for a wide range of applications, including consumer electronics, telecommunications, automotive, industrial equipment, and more.
The FR4 material consists of a thin layer of copper foil laminated onto a substrate made of woven fiberglass cloth impregnated with epoxy resin. The copper layer is etched to create the desired circuit pattern, and the remaining copper traces provide the electrical connections between components.
The FR4 substrate offers good dimensional stability, which is important for maintaining the integrity of the circuitry over a wide range of temperatures. It also has low electrical conductivity, which helps prevent short circuits between adjacent traces.
In addition to its electrical properties, FR4 has good flame retardant properties due to the presence of halogenated compounds in the epoxy resin. This makes FR4 PCBs suitable for applications where fire safety is a concern.
Overall, FR4 PCBs are widely used in the electronics industry due to their excellent combination of electrical performance, mechanical strength, thermal stability, and flame retardancy.
