2 Layer Rogers 6006 / 6010 HF PCB High Frequency Printed Circuit Board

2 Layer Rogers 6006 / 6010 HF PCB High Frequency Printed Circuit Boards

Rogers PCB information:

Material:rogers6010 0.635MM

DK:10.2

Layer:2

Surface finish: immersion gold

Application:Microwave / RF field

Board thickness:0.8MM

Min lind width and space:8mil

Min hole:0.3MM

Features and benefits:

• High dielectric constant for circuit size reduction

• Low loss. Ideal for operating at X-band or below

• Low Z-axis expansion for RT/ duroid 6010LM. Provides reliable

plated through holes in multilayer boards

• Low moisture absorption for RT/duroid 6010LM. Reduces effects of moisture on electrical loss

• Tight and thickness control for repeatable circuit performance

Rogers 6006 / 6010 information:

RT/duroid 6006/6010LM microwave laminates are ceramic-

PTFE composites designed for electronic and microwave circuit

applications requiring a high dielectric constant. RT/duroid 6006

laminate is available with a dielectric constant value of 6.15 and

RT/duroid 6010LM laminate has a dielectric constant of 10.2.

RT/duroid 6006/6010LM microwave laminates feature ease of fabrication

and stability in use. They have tight dielectric constant and thickness

control, low moisture absorption, and good thermal mechanical stability.

Standard tolerance dielectric thicknesses of 0.010”, 0.025”, 0.050”, 0.075”,

and 0.100” (0.254, 0.635, 1.270, 1.905, 2.54 mm) are available. When

ordering RT/duroid 6006 and RT/duroid 6010LM laminates, it is important

to specify dielectric thickness and weight of copper foil required.

High frequency PCB range:

Frequency Range: High-frequency PCBs are designed to operate in frequency ranges typically starting from a few megahertz (MHz) and extending into the gigahertz (GHz) and terahertz (THz) ranges. These PCBs are commonly used in applications such as wireless communication systems (e.g., cellular networks, Wi-Fi, Bluetooth), radar systems, satellite communication, and high-speed data transmission.

Signal Loss and Dispersion: At high frequencies, signal loss and dispersion become significant concerns. High-frequency PCBs employ techniques to minimize these effects, such as using low-loss dielectric materials, controlled impedance routing, and minimizing the length and number of vias.

PCB Stackup: The stackup configuration of a high-frequency PCB is carefully designed to address signal integrity requirements. It typically consists of multiple layers of copper traces, dielectric materials, and ground planes. The arrangement of these layers is optimized to control impedance, minimize crosstalk, and provide shielding.

RF Connectors: High-frequency PCBs often incorporate specialized RF connectors to ensure proper signal transmission and minimize losses. These connectors are designed to maintain consistent impedance and minimize reflections.

Electromagnetic Compatibility (EMC): High-frequency PCBs must comply with electromagnetic compatibility standards to prevent interference with other electronic devices and to avoid susceptibility to external interference. Proper grounding, shielding, and filtering techniques are employed to address EMC requirements.

Simulation and Analysis: Designing high-frequency PCBs often involves simulation and analysis using specialized software tools. These tools allow designers to assess signal integrity, impedance matching, and electromagnetic behavior before fabrication, helping to optimize the PCB design for high-frequency performance.

Fabrication Challenges: Fabricating high-frequency PCBs can be more challenging compared to standard PCBs. The use of specialized materials, controlled impedance requirements, and tight tolerances require advanced fabrication techniques such as accurate etching, controlled dielectric thickness, and precise drilling and plating processes.

Testing and Validation: High-frequency PCBs undergo rigorous testing and validation to ensure their performance meets the desired specifications. This includes impedance testing, signal integrity analysis, insertion loss measurement, and other RF and microwave tests.

It's important to note that the design and manufacturing of high-frequency PCBs are specialized areas requiring expertise in RF and microwave engineering, PCB layout, and fabrication processes. Working with experienced professionals and consulting relevant design guidelines and standards is crucial to ensure reliable performance at high frequencies.

High frequency PCB description:

High-frequency PCB (Printed Circuit Board) refers to a type of PCB that is designed to handle high-frequency signals, typically in the radio frequency (RF) and microwave ranges. These PCBs are engineered to minimize signal loss, maintain signal integrity, and control impedance at high frequencies.

Here are some key considerations and features of high-frequency PCBs:

Material Selection: High-frequency PCBs often use specialized materials with low dielectric constant (Dk) and low dissipation factor (Df). Common materials include PTFE (Polytetrafluoroethylene), FR-4 with enhanced properties, and specialized laminates like Rogers or Taconic.

Controlled Impedance: Maintaining consistent impedance is crucial for high-frequency signals. High-frequency PCBs employ controlled impedance routing, which involves precise trace widths, spacing, and dielectric thickness to achieve the desired characteristic impedance.

Signal Integrity: High-frequency signals are susceptible to noise, reflections, and losses. PCB design techniques such as proper ground plane placement, signal return paths, and controlled crosstalk are employed to minimize signal degradation and maintain signal integrity.

Transmission Lines: High-frequency PCBs often incorporate transmission lines, such as microstrip or stripline, to carry the high-frequency signals. These transmission lines have specific geometries to control impedance and minimize signal loss.

Via Design: Vias can impact signal integrity at high frequencies. High-frequency PCBs may use techniques like back drilling or buried vias to minimize signal reflections and maintain signal integrity across layers.

Component Placement: Careful consideration is given to component placement to minimize signal path lengths, reduce parasitic capacitance and inductance, and optimize signal flow.

Shielding: To minimize electromagnetic interference (EMI) and RF leakage, high-frequency PCBs may employ shielding techniques such as copper pours, ground planes, or metal shielding cans.

High-frequency PCBs find applications in various industries, including wireless communication systems, aerospace, radar systems, satellite communication, medical devices, and high-speed data transmission.

Designing and manufacturing high-frequency PCBs require specialized skills, knowledge, and simulation tools to ensure the desired performance at high frequencies. It is often recommended to work with experienced PCB designers and manufacturers who specialize in high-frequency applications.

High frequency PCB material in stock:

Brand	Model	Thickness(mm)	DK(ER)
Rogers	RO4003C	0.203mm,0.305mm,0.406mm,0.508mm,0.813mm,1.524mm	3.38 ± 0.05
	RO4350B	0.101mm,0.168mm,0.254mm,0.338mm,0.422mm,0.508mm,0.762mm,1.524mm	3.48 ± 0.05
	RO4360G2	0.203mm,0.305mm,0.406mm,0.508mm,0.610mm,0.813mm,1.524mm	6.15 ± 0.15
	RO4835	0.168mm,0.254mm,0.338mm,0.422mm,0.508mm,0.591mm, 0.676mm,0.762mm,1.524mm	3.48 ± 0.05
	RT5870	0.127mm,0.787mm,0.254mm,1.575mm,0.381mm,3.175mm,0.508mm	2.33 2.33 ± 0.02
	RT5880	0.127mm,0.787mm,0.254mm,1.575mm,0.381mm,3.175mm,0.508mm	2.20 2.20 ± 0.02
	RO3003	0.13mm,0.25mm,0.50mm,0.75mm,1.52mm	3.00 ±0.04
	RO3010	0.13mm,0.25mm,0.64mm,1.28mm	10.2 ± 0.30
	RO3006	0.13mm,0.25mm,0.64mm,1.28mm	6.15 ± 0.15
	RO3203	0.25mm,0.50mm,0.75mm,1.52mm	3.02±0.04
	RO3210	0.64mm,1.28mm	10.2±0.50
	RO3206	0.64mm,1.28mm	6.15±0.15
	R03035	0.13mm,0.25mm,0.50mm,0.75mm,1.52mm	3.50 ± 0.05
	RT6002	0.127mm,0.254mm,0.508mm,0.762mm,1.524mm,3.048mm	2.94 ± 0.04
	RT6006	0.127mm,0.254mm,0.635mm,1.27mm,1.90mm,2.50mm	6.15± 0.15
	RT6010	0.127mm,0.254mm,0.635mm,1.27mm,1.90mm,2.50mm	10.2 ± 0.25
TACONIC	TLX-8.TLX-9	0.508. 0.762	2.45-2.65
	TLC-32	0.254,0.508,0.762	3.35
	TLY-5	0.254,0.508.0.8,	2.2
	RF-60A	0.254.0.508.0.762	6.15
	CER-10	0.254.0.508.0.762	10
	RF-30	0.254.0.508.0.762	3
	TLA-35	0.8	3.2
ARLON	AD255C06099C	1.5	2.55
	MCG0300CG	0.8	3.7
	AD0300C	0.8	3
	AD255C03099C	0.8	2.55
	AD255C04099C	1	2.55
	DLC220	1	2.2