ISOLA PCB High TG Stable DK Value 0.2mm-6mm High Frequency Circuit Board

ISOLA PCB High TG Stable DK Value High Frequency Circuit Board

Quick detail:

Size: 18*10cm

Copper THK:35UM

Color: Green

Material: Isola laminate

Surface finish:Immersion gold,ENIG

6 layer 1.2mm thickness

Green solder mask,white silk screen

Line space and width:10mil

Certification:ISO9001/SGS/UL

Delivery time:3-7 working days

Most popular isola PCB material model:

Isola fr402,370HR,fr408,Isola410

Isola PCB laminate Advantage:

Have stock of Scarcity of isola 370HR material,

short time of incoming material,save costing for you

Isola substrate is a high performance 180°C glass transition temperature

(Tg) FR-4 system for multilayer Printed Wiring Board (PWB)

applications where maximum thermal performance and reliability

are required. 370HR laminate and prepreg products are

manufactured with a unique high performance multifunctional

epoxy resin, reinforced with electrical grade (E-glass) glass fabric.

This system provides improved thermal performance and low

expansion rates in comparison to traditional FR-4 while retaining

FR-4 processability.

In addition to this superior thermal performance, the mechanical,

chemical and moisture resistance properties all equal or exceed

the performance of traditional FR-4 materials. The 370HR system

is also laser fluorescing and UV blocking for maximum compatibility

with Automated Optical Inspection (AOI) systems, optical positioning

systems and photoimagable solder mask imaging.

370HR has proven to be best in class for sequential lamination

Isola PCB Features

• High Thermal Performance

 Tg: 180°C (DSC)

 Td: 360°C (TGA @ 5% wt loss)

• T260: 60 minutes

• T288: 15 minutes

• RoHS Compliant

• UV Blocking and AOI Fluorescence

 High throughput and accuracy during PCB

fabrication and assembly

• Superior Processing

Closest to conventional FR-4 processing of all

high speed materials

• Core Material Standard Availability

 Thickness: 0.002″ (0.05 mm) to 0.125″

(3.2 mm)

 Available in full size sheet or panel form

• Prepreg Standard Availability

 Roll or panel form

 Tooling of prepreg panels available

• Copper Foil Type Availability

 Standard HTE Grade 3

 RTF (Reverse Treat Foil)

• Copper Weights

 1 and 2 oz (18, 35 and 70 μm) available

 Heavier copper available upon request

 Thinner copper foil available upon request

• Glass Fabric Availability

 Standard E-glass

 Square weave glass fabric available

• Industry Approvals

 IPC-4101D WAM1 /24 /121 /124

 UL - File Number E41625

 Qualified to UL's MCIL Program

High frequency PCB range:

Frequency Range: High-frequency PCBs are designed to operate in frequency ranges typically starting from a few megahertz (MHz) and extending into the gigahertz (GHz) and terahertz (THz) ranges. These PCBs are commonly used in applications such as wireless communication systems (e.g., cellular networks, Wi-Fi, Bluetooth), radar systems, satellite communication, and high-speed data transmission.

Signal Loss and Dispersion: At high frequencies, signal loss and dispersion become significant concerns. High-frequency PCBs employ techniques to minimize these effects, such as using low-loss dielectric materials, controlled impedance routing, and minimizing the length and number of vias.

PCB Stackup: The stackup configuration of a high-frequency PCB is carefully designed to address signal integrity requirements. It typically consists of multiple layers of copper traces, dielectric materials, and ground planes. The arrangement of these layers is optimized to control impedance, minimize crosstalk, and provide shielding.

RF Connectors: High-frequency PCBs often incorporate specialized RF connectors to ensure proper signal transmission and minimize losses. These connectors are designed to maintain consistent impedance and minimize reflections.

Electromagnetic Compatibility (EMC): High-frequency PCBs must comply with electromagnetic compatibility standards to prevent interference with other electronic devices and to avoid susceptibility to external interference. Proper grounding, shielding, and filtering techniques are employed to address EMC requirements.

Simulation and Analysis: Designing high-frequency PCBs often involves simulation and analysis using specialized software tools. These tools allow designers to assess signal integrity, impedance matching, and electromagnetic behavior before fabrication, helping to optimize the PCB design for high-frequency performance.

Fabrication Challenges: Fabricating high-frequency PCBs can be more challenging compared to standard PCBs. The use of specialized materials, controlled impedance requirements, and tight tolerances require advanced fabrication techniques such as accurate etching, controlled dielectric thickness, and precise drilling and plating processes.

Testing and Validation: High-frequency PCBs undergo rigorous testing and validation to ensure their performance meets the desired specifications. This includes impedance testing, signal integrity analysis, insertion loss measurement, and other RF and microwave tests.

It's important to note that the design and manufacturing of high-frequency PCBs are specialized areas requiring expertise in RF and microwave engineering, PCB layout, and fabrication processes. Working with experienced professionals and consulting relevant design guidelines and standards is crucial to ensure reliable performance at high frequencies.

High frequency PCB description:

High-frequency PCB (Printed Circuit Board) refers to a type of PCB that is designed to handle high-frequency signals, typically in the radio frequency (RF) and microwave ranges. These PCBs are engineered to minimize signal loss, maintain signal integrity, and control impedance at high frequencies.

Here are some key considerations and features of high-frequency PCBs:

Material Selection: High-frequency PCBs often use specialized materials with low dielectric constant (Dk) and low dissipation factor (Df). Common materials include PTFE (Polytetrafluoroethylene), FR-4 with enhanced properties, and specialized laminates like Rogers or Taconic.

Controlled Impedance: Maintaining consistent impedance is crucial for high-frequency signals. High-frequency PCBs employ controlled impedance routing, which involves precise trace widths, spacing, and dielectric thickness to achieve the desired characteristic impedance.

Signal Integrity: High-frequency signals are susceptible to noise, reflections, and losses. PCB design techniques such as proper ground plane placement, signal return paths, and controlled crosstalk are employed to minimize signal degradation and maintain signal integrity.

Transmission Lines: High-frequency PCBs often incorporate transmission lines, such as microstrip or stripline, to carry the high-frequency signals. These transmission lines have specific geometries to control impedance and minimize signal loss.

Via Design: Vias can impact signal integrity at high frequencies. High-frequency PCBs may use techniques like back drilling or buried vias to minimize signal reflections and maintain signal integrity across layers.

Component Placement: Careful consideration is given to component placement to minimize signal path lengths, reduce parasitic capacitance and inductance, and optimize signal flow.

Shielding: To minimize electromagnetic interference (EMI) and RF leakage, high-frequency PCBs may employ shielding techniques such as copper pours, ground planes, or metal shielding cans.

High-frequency PCBs find applications in various industries, including wireless communication systems, aerospace, radar systems, satellite communication, medical devices, and high-speed data transmission.

Designing and manufacturing high-frequency PCBs require specialized skills, knowledge, and simulation tools to ensure the desired performance at high frequencies. It is often recommended to work with experienced PCB designers and manufacturers who specialize in high-frequency applications.

High frequency PCB material in stock:

Brand	Model	Thickness(mm)	DK(ER)
Rogers	RO4003C	0.203mm,0.305mm,0.406mm,0.508mm,0.813mm,1.524mm	3.38 ± 0.05
	RO4350B	0.101mm,0.168mm,0.254mm,0.338mm,0.422mm,0.508mm,0.762mm,1.524mm	3.48 ± 0.05
	RO4360G2	0.203mm,0.305mm,0.406mm,0.508mm,0.610mm,0.813mm,1.524mm	6.15 ± 0.15
	RO4835	0.168mm,0.254mm,0.338mm,0.422mm,0.508mm,0.591mm, 0.676mm,0.762mm,1.524mm	3.48 ± 0.05
	RT5870	0.127mm,0.787mm,0.254mm,1.575mm,0.381mm,3.175mm,0.508mm	2.33 2.33 ± 0.02
	RT5880	0.127mm,0.787mm,0.254mm,1.575mm,0.381mm,3.175mm,0.508mm	2.20 2.20 ± 0.02
	RO3003	0.13mm,0.25mm,0.50mm,0.75mm,1.52mm	3.00 ±0.04
	RO3010	0.13mm,0.25mm,0.64mm,1.28mm	10.2 ± 0.30
	RO3006	0.13mm,0.25mm,0.64mm,1.28mm	6.15 ± 0.15
	RO3203	0.25mm,0.50mm,0.75mm,1.52mm	3.02±0.04
	RO3210	0.64mm,1.28mm	10.2±0.50
	RO3206	0.64mm,1.28mm	6.15±0.15
	R03035	0.13mm,0.25mm,0.50mm,0.75mm,1.52mm	3.50 ± 0.05
	RT6002	0.127mm,0.254mm,0.508mm,0.762mm,1.524mm,3.048mm	2.94 ± 0.04
	RT6006	0.127mm,0.254mm,0.635mm,1.27mm,1.90mm,2.50mm	6.15± 0.15
	RT6010	0.127mm,0.254mm,0.635mm,1.27mm,1.90mm,2.50mm	10.2 ± 0.25
TACONIC	TLX-8.TLX-9	0.508. 0.762	2.45-2.65
	TLC-32	0.254,0.508,0.762	3.35
	TLY-5	0.254,0.508.0.8,	2.2
	RF-60A	0.254.0.508.0.762	6.15
	CER-10	0.254.0.508.0.762	10
	RF-30	0.254.0.508.0.762	3
	TLA-35	0.8	3.2
ARLON	AD255C06099C	1.5	2.55
	MCG0300CG	0.8	3.7
	AD0300C	0.8	3
	AD255C03099C	0.8	2.55
	AD255C04099C	1	2.55
	DLC220	1	2.2