Ceramic Laminates Rogers PCB Circuit Board Material Full Range DK

Rogers Ceramic Laminates PCB Circuit Board Material Full Range DK

Quick detail:

Layer:2

Material: rogers ceramic

Copper weight:1OZ

Surface finish: HASL lead free

Board thickness: 1.6mm

Solder mask: Green

About ceramic PCB

The types of ceramic pcb substrates:

high temperature fusion ceramic substrate (HTFC)

low temperature co-fired multilayer ceramic (LTCC)

high temperature co-fired multilayer ceramic (HTCC)

direct bonding copper substrate (DBC)

Direct Copper Plating (DPC)

if you want to use PCB in high pressure, high insulation, high frequency, high temperature, and high reliable and minor volume electronic products, then Ceramic PCB will be your best choice.

This product is composed of a noble metal consisting of high-conductivity dielectric circuit and high thermal conductivity of insulating material combination of high thermal conductivity substrate. Can effectively solve the problem of low thermal conductivity of PCB and aluminum plate. To effectively heat the heat generated by the electronic components derived to increase component stability and extend the service life.

Why Ceramic PCB has such excellent performance? You can have a brief view on its basic structure and then you will understand.

96% or 98% Alumina (Al2O3), Aluminum Nitride (AIN), or Beryllium Oxide (BeO)

Conductors material: For thin, thick film technology, it'll be silver palladium (AgPd), gold pllladium (AuPd); For DCB (Direct Copper Bonded) it'll be copper only

Application temp: -55~850C

Thermal conductivity value: 24W~28W/m-K (Al2O3); 150W~240W/m-K for AIN , 220~250W/m-K for BeO;

Max compression strength: >7,000 N/cm2

Breakdown Voltage (KV/mm): 15/20/28 for 0.25mm/0.63mm/1.0mm respectively

Thermal expansion conefficient(ppm/K): 7.4 (under 50~200C)

Ceramic pcb is also a branch of the printed circuit board, ceramic substrate and CEM material substrate, FR-4 substrate is parallel, the production process is same, but the support material is not the same, so there is no substitute circuit board argument.

Now more than 90% of the market are FR-4 materials, the proportion of ceramic substrate is relatively small, and will not become mainstream.

Ceramic PCB application:

1. High-precision clock oscillator, voltage-controlled oscillator, temperature compensation oscillator ceramic circuit board.

2. Metallization of Ceramic Substrates for Refrigeration.

3. Metallization of surface - mount inductive ceramic substrate. Metalization of Inductor Core Electrode.

4. Power electronic control module high insulation high voltage ceramic circuit board.

5. High - temperature circuit ceramic circuit board.

6. Solid state relay ceramic circuit board.

7. DC-DC module power supply ceramic circuit board.

8. Automotive, motorcycle regulator, ignition module.

9. Power transmitter module.

Rogers PCB applications.

Moreover, since nowadays 5G Technology developments are growing quickly, various devices request high-frequency PCBs and RF PCBs with high performance which need not only low electrical noise but also low signal losses. And Rogers PCB material is a perfect choice to match the technological characteristics, besides it is also cost-effective for this purpose. Some Rogers PCB applications are:

1 .Automotive Radar and Sensors
2. Microwave equipment of all kinds.
3. Cellular Base Station Antennas
4. RF Identification (RFID) Tags
5. 5G Station
6. Microwave point to point (P2P) links
7. LNB’s for Direct Broadcast Satellites

RT/duriod

Rogers RT/duroid® high-frequency circuit materials are filled PTFE (irregular glass or ceramic) composite coversfor use in high reliability, aviation and defense applications. The RT/duroid types have a long industry nearness of providing high-reliability materials with predominant performance. This kind of material has several benefits:

1 Low electrical loss,
2. Low moisture absorption,
3. Stable dielectric constant (Dk) over a wide frequency range, and
4. Low outgassing for space applications.

RO3000

RO3000 laminates are ceramic filled PTFE composites intended for use in the commercial microwave and RF applications. R03000 series laminates are circuit materials with very consistent mechanical properties regardless of the dielectric constant selected. Due to this characteristic, when designing multi-layer boards with varying dielectric constants, there will be very little issues if any at all The dielectric constant VS temperature of RO3000 series materials is very stable. RO3000 laminates also are available in a wide range of dielectric constants (3.0 to 10.2). The most common applications are:

1. Surface mount RF components,
2.GPS antennas, and
3. Power amplifiers.

RO4000

RO4000 laminates and pre-pregs possess favorable properties that are highly useful in microwave circuits and instances where controlled impedance is needed. This series of laminates are very price optimized and are also fabricated using standard FR4 processes which makes it suitable for multi-layer PCBs. Additionally, it can be processed lead-free. The series of RO4000 laminates offer a range of dielectric constants (2.55-6.15) and are available with UL 94 V-0 flame retardant versions. The most popular applications of this are:

1. RFID chips,
2. Power amplifiers,
3. Automotive radars, and
4. Sensors.

TMM®
Rogers TMM® thermoset microwave laminates fuse dielectric constant uniformity, low thermal coefficient of dielectric constant (Dk), and a copper matched coefficient of thermal expansion. Because of their electrical and mechanical stability, TMM high-frequency laminates are perfect for high-reliability strip-line and micro-strip applications. This kind of material has several benefits:

1. Wide range of dielectric constants (Dks),
2.Excellent mechanical properties, cold flow, and resists creep,
3. Exceptionally low thermal coefficient of Dk,
4. Coefficient of thermal expansion fit to copper taking into account high reliability of plated through-holes,
5. Available copper clad in larger formats, allowing the use of standard PCB subtractive processes,
6. No wreck to materials during fabrication and assembly processes,  Resistant to process chemicals,
7. Thermoset resin for reliable wire bonding,
8. No specialized production techniques required,
9. TMM 10 and 10i laminates can replace alumina substrates, and
10. RoHS compliant, environmentally friendly.Below is a table that shows the characteristics of various types of PCB materials.