0.762mm Rogers 4350 4 Layer Blind Hole HDI PCB Board For Bank Of The Secret Key

Rogers 4350 0.762mm 4 Layer Blind Hole HDI PCB Board For Bank of the Secret Key

Buried Blind hole rogers pcb board

Rogers high frequency pcb widely used in the area of high technologies like communication device,Electronics,Aerospace,Military industry and so on. we have accumulated abandunt experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,line amplifier,base station,RF antena,4G antena etc.

We have sufficient rogers material raw as follow:RO4003C,RO4350B,RO4360,RO4533,RO4535,RO4730,RO4232,RO4233,RO3003,RO3006,RO3010,RO3035,RO3203,RO3206,RO3210,RO3730,RO5780,RO5880,RO6002,RO3202,RO6006,Frequently-used is 4003C,4350B,5880

So we can do pcb circuit board with your detail requirements in the case of you send us gerber files or any other files

PCB Parameter:

Pcb Board Prototype, Pcb Design And Fabrication

What are PCB through holes, blind holes, buried holes?

Through Hole: Plating Through Hole (PTH), this is the most common type. You just need to pick up the PCB and face the light. You can see that the light hole is the "through hole". This is also the simplest kind of hole, because it is only necessary to use the drill or laser to make the circuit board full drilling, and the cost is relatively cheap. But in contrast, some circuit layers do not need to connect these through holes. For example, we have a six-story house. I bought it on the third and fourth floors. I want to design a staircase inside to connect only the third floor. It can be between the fourth floor. For me, the space on the fourth floor is virtually invisible by the original first floor connecting to the sixth floor stairs. Therefore, although the through hole is cheap, sometimes it will use more PCB space.

Blind hole: Blind Via Hole, which connects the outermost circuit of the PCB to the adjacent inner layer with a plated hole. Because it is not visible, it is called "blind pass". In order to increase the space utilization of the PCB circuit layer, a "blind hole" process has emerged. This method requires special attention to the depth of the hole (Z-axis) to be just right. This method is often difficult to plate in the hole, so it is almost un-manufacturable. It is also possible to connect the circuit layers that need to be connected to the individual circuit layers in advance. At the time, the holes are drilled first and finally glued together, but a more precise positioning and alignment device is required.

Buried hole: Buried hole, the connection of any circuit layer inside the PCB but not to the outer layer. This process can not be achieved by means of bonding after drilling. It is necessary to perform drilling at the time of individual circuit layers. After partially bonding the inner layer, it must be electroplated first, and finally it can be fully bonded, compared with the original "through hole". The "blind hole" takes more time, so the price is also the most expensive. This process is typically only used on high density (HDI) boards to increase the usable space of other circuit layers.

RT/duriod

Rogers RT/duroid® high-frequency circuit materials are filled PTFE (irregular glass or ceramic) composite coversfor use in high reliability, aviation and defense applications. The RT/duroid types have a long industry nearness of providing high-reliability materials with predominant performance. This kind of material has several benefits:

1 Low electrical loss,
2. Low moisture absorption,
3. Stable dielectric constant (Dk) over a wide frequency range, and
4. Low outgassing for space applications.

RO3000

RO3000 laminates are ceramic filled PTFE composites intended for use in the commercial microwave and RF applications. R03000 series laminates are circuit materials with very consistent mechanical properties regardless of the dielectric constant selected. Due to this characteristic, when designing multi-layer boards with varying dielectric constants, there will be very little issues if any at all The dielectric constant VS temperature of RO3000 series materials is very stable. RO3000 laminates also are available in a wide range of dielectric constants (3.0 to 10.2). The most common applications are:

1. Surface mount RF components,
2.GPS antennas, and
3. Power amplifiers.

RO4000

RO4000 laminates and pre-pregs possess favorable properties that are highly useful in microwave circuits and instances where controlled impedance is needed. This series of laminates are very price optimized and are also fabricated using standard FR4 processes which makes it suitable for multi-layer PCBs. Additionally, it can be processed lead-free. The series of RO4000 laminates offer a range of dielectric constants (2.55-6.15) and are available with UL 94 V-0 flame retardant versions. The most popular applications of this are:

1. RFID chips,
2. Power amplifiers,
3. Automotive radars, and
4. Sensors.

TMM®
Rogers TMM® thermoset microwave laminates fuse dielectric constant uniformity, low thermal coefficient of dielectric constant (Dk), and a copper matched coefficient of thermal expansion. Because of their electrical and mechanical stability, TMM high-frequency laminates are perfect for high-reliability strip-line and micro-strip applications. This kind of material has several benefits:

1. Wide range of dielectric constants (Dks),
2.Excellent mechanical properties, cold flow, and resists creep,
3. Exceptionally low thermal coefficient of Dk,
4. Coefficient of thermal expansion fit to copper taking into account high reliability of plated through-holes,
5. Available copper clad in larger formats, allowing the use of standard PCB subtractive processes,
6. No wreck to materials during fabrication and assembly processes,  Resistant to process chemicals,
7. Thermoset resin for reliable wire bonding,
8. No specialized production techniques required,
9. TMM 10 and 10i laminates can replace alumina substrates, and
10. RoHS compliant, environmentally friendly.Below is a table that shows the characteristics of various types of PCB materials.