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High Frequency Substrate Rogers Ro3003g2 PCB Circuit Board
Detail Product Description:
| Base material | Rogers3010 0.635MM | Product name | High frequency pcb fabrication |
| Layer | 2 | Copper thickness | 1OZ |
| Board thickness | 0.8MM | Surface finish | Gold plating |
| Min line width | 0.1mm | Min line spacing | 0.1mm |
| Rogers material | 3010 | Service | Rogers pcb fabrication |
| Application | telecommunication | Board size | 6*9CM |
Printed Circuit Board Fabrication:
PCB fabrication technology can be divided into single-sided, double-sided and multi-layer PCB
PCB Fabrication machine:
◆Cut machine
◆ Line exposure machine
◆ Etching line
◆ Drilling machine
◆ Plating line
◆ Screen printing machine
◆ Optical Inspection Machine
◆ Brown line
◆ Fully automatic laminator
◆ Molding machine
◆ Electric testing machine
◆ Immersion gold production line
The thickness of pcb fabrication
Multi-layer PCB thickness of the stack, a direct impact on the control of the impedance.
Finished board thickness, affect the accuracy of the assembly.
The thickness of the copper foil affects the heat dissipation and the DC resistance of the current.
Many years experience of pcb fabrication
Over than 10 years
Some Typical Applications:
• Automotive radar applications
• Global positioning satellite
antennas
• Cellular telecommunications
systems - power amplifi ers and
antennas
• Patch antenna for wireless
communications
• Direct broadcast satellites
• Datalink on cable systems
• Remote meter readers
RT/duriod
Rogers RT/duroid® high-frequency circuit materials are filled PTFE (irregular glass or ceramic) composite coversfor use in high reliability, aviation and defense applications. The RT/duroid types have a long industry nearness of providing high-reliability materials with predominant performance. This kind of material has several benefits:
1 Low electrical loss,
2. Low moisture absorption,
3. Stable dielectric constant (Dk) over a wide frequency range, and
4. Low outgassing for space applications.
RO3000
RO3000 laminates are ceramic filled PTFE composites intended for use in the commercial microwave and RF applications. R03000 series laminates are circuit materials with very consistent mechanical properties regardless of the dielectric constant selected. Due to this characteristic, when designing multi-layer boards with varying dielectric constants, there will be very little issues if any at all The dielectric constant VS temperature of RO3000 series materials is very stable. RO3000 laminates also are available in a wide range of dielectric constants (3.0 to 10.2). The most common applications are:
1. Surface mount RF components,
2.GPS antennas, and
3. Power amplifiers.
RO4000
RO4000 laminates and pre-pregs possess favorable properties that are highly useful in microwave circuits and instances where controlled impedance is needed. This series of laminates are very price optimized and are also fabricated using standard FR4 processes which makes it suitable for multi-layer PCBs. Additionally, it can be processed lead-free. The series of RO4000 laminates offer a range of dielectric constants (2.55-6.15) and are available with UL 94 V-0 flame retardant versions. The most popular applications of this are:
1. RFID chips,
2. Power amplifiers,
3. Automotive radars, and
4. Sensors.
TMM®
Rogers TMM® thermoset microwave laminates fuse dielectric constant uniformity, low thermal coefficient of dielectric constant (Dk), and a copper matched coefficient of thermal expansion. Because of their electrical and mechanical stability, TMM high-frequency laminates are perfect for high-reliability strip-line and micro-strip applications. This kind of material has several benefits:
1. Wide range of dielectric constants (Dks),
2.Excellent mechanical properties, cold flow, and resists creep,
3. Exceptionally low thermal coefficient of Dk,
4. Coefficient of thermal expansion fit to copper taking into account high reliability of plated through-holes,
5. Available copper clad in larger formats, allowing the use of standard PCB subtractive processes,
6. No wreck to materials during fabrication and assembly processes, Resistant to process chemicals,
7. Thermoset resin for reliable wire bonding,
8. No specialized production techniques required,
9. TMM 10 and 10i laminates can replace alumina substrates, and
10. RoHS compliant, environmentally friendly.Below is a table that shows the characteristics of various types of PCB materials.
