ONESEINE TECHNOLOGY CO.,LTD
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Customized 6 Layer Rigid Flex Circuit Design From Shenzhen Manufacture
Quick details:
Number of layer:6
Board thickness:1.2mm
Brand: ONESEINE
Sample order:Acceptable
Application: Electronics products
Surface finish:Immersion gold
Item:rigid-flex PCB boards
Our Services
Our Services
We are able to provide you best electronics services We are able to provide you best electronics services.
1) PCB Production
2) Service.(FR-4,HI-TG,Aluminum,FPC,,Rogers,CEM-1 )
2) FPC,PCB Copy Service.
3) PCB Assembly Service. (SMT, BGA, DIP)
4) IC program with HEX file.
5) PCBA Housing assembly serivce.
6) PCBA Final Functional Testing.
7) PCBA Copy Service.
8) Electronic Components Purchasing & BOM List Purchasing Services.
9) PCB SMT Stencil. (Laser cut & Etching)
10) Cable assembly
Why us ?
1) Professional engineer team --help you to check design and do engineering before production
2) Rich expierences in pcb production industry--provide high quality and competitive price pcb.
3) After-sales service--every problem you have will get our professional advice and solution.
4) Constant follow up-- make us have the fast reaction of your requirement.
5) Inspected by the Inspection Institution--ISO,UL,ROHS cerfiticated
Process Capability
1) Bare Printed Circuit Board Process Capability:
| 1 | Layers | Single Sided,2 to 18 Layer |
| 2 | Board material type | FR4,CEM-1,CEM-3,ceramic substrate board, aluminum based board, high-Tg, Rogers and more |
| 3 | Compound material lamination | 4 to 6 layers |
| 4 | Maximum dimension | 610 x 1,100mm |
| 5 | Dimension tolerance | ±0.13mm |
| 6 | Board thickness coverage | 0.2 to 6.00mm |
| 7 | Board thickness tolerance | ±10% |
| 8 | DK thickness | 0.076 to 6.00mm |
| 9 | Minimum line width | 0.10mm |
| 10 | Minimum line space | 0.10mm |
| 11 | Outer layer copper thickness | 8.75 to 175µm |
| 12 | Inner layer copper thickness | 17.5 to 175µm |
| 13 | Drilling hole diameter (mechanical drill) | 0.25 to 6.00mm |
| 14 | Finished hole diameter (mechanical drill) | 0.20 to 6.00mm |
| 15 | Hole diameter tolerance (mechanical drill) | 0.05mm |
| 16 | Hole position tolerance (mechanical drill) | 0.075mm |
| 17 | Laser drill hole size | 0.10mm |
| 18 | Board thickness and hole diameter ratio | 10:1 |
| 19 | Solder mask type | Green, Yellow, Black, Purple, Blue, White and Red |
| 20 | Minimum solder mask | Ø0.10mm |
| 21 | Minimum size of solder mask separation ring | 0.05mm |
| 22 | Solder mask oil plug hole diameter | 0.25 to 0.60mm |
| 23 | Impedance control tolerance | ±10% |
| 24 | Surface finish | Hot air level, ENIG, immersion silver, gold plating, immersion tin and gold finger |
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Rigid-flex PCB introduction:
A rigid-flex PCB (printed circuit board) is a type of circuit board that combines both rigid and flexible materials in its construction. It offers the advantages of both rigid and flexible PCBs, making it suitable for applications where space constraints, complex geometries, and reliable interconnections are important.
In a rigid-flex PCB, the board consists of multiple layers of rigid materials, typically FR4, and flexible materials, such as polyimide. The rigid portions provide structural support and accommodate components, while the flexible areas allow the board to bend or fold as needed.
Rigid-flex PCBs are commonly used in electronic devices that require a compact form factor, such as smartphones, tablets, wearables, and aerospace applications. They offer several benefits over traditional rigid PCBs, including:
Size reduction: Rigid-flex PCBs can eliminate the need for connectors and cables, enabling a significant reduction in space requirements.
Increased reliability: Rigid-flex PCBs have fewer interconnects and solder joints compared to traditional PCBs, reducing the potential points of failure. They also offer better resistance to vibration and thermal stress.
Improved signal integrity: The combination of rigid and flexible materials allows for optimized signal routing, reducing signal loss, and improving overall signal integrity.
Enhanced design flexibility: Rigid-flex PCBs can be designed to fit complex and irregular shapes, conforming to the available space in a device. This flexibility enables innovative product designs.
